Micro-machined switch and method of fabrication
US5121089A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 1, 1990 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Nov 1, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0078
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A miniature electrostatically actuated switch and process for fabricating it in which the switch is operable to connect and disconnect one or more transmission lines laid down on a dielectric substrate of an integrated circuit wafer. The switch is fabricated on the integrated circuit wafer using integrated circuit fabrication processes including thin films of conductive materials and photoresist and selective removal of these films. the switch includes a rotating switch blade which rotates about a hub formed on the dielectric substrate under the influence of electrostatic fields created by control pads and other switch elements formed on the dielectric substrate, whereupon a microwave signal can be switchably transmitted along the transmission line formed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.