Electric device having a leadframe covered with an antioxidation film
US5121187A · kind A · utility
7Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1989 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Oct 11, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved electric device and a manufacturing method for the same is described. The device is for example an IC chip clothed with molding. The IC chip is mounted on a lead frame by means of an adhesive such as a glass-type silver paste which discharges little amount of gases and the rear surface of the lead frame is covered with an antioxidation film of silicon nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.