Apparatus for solder joining metal tapes
US5121869A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solde…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.