Prestressed article and method
US5122213A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 15, 1991 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Jan 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1048
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A prestressed thermoformed panel, comprising an inner thermoplastic layer having fine grooves on the outer surfaces thereof, and outer fiber-reinforced thermosetting layers bonded to the outer surfaces of the inner layer. The grooves of the inner layer are of a size, pattern and orientation similar to that of the fibers of the thermosetting materials so that at least some of the fibers are positioned in the grooves to enhance the strength of the panel. In the method of forming the panel, the inner and outer layers are heated to approximately the fusion temperature of the thermoplastic material while applying inward pressure on the outer layers in the direction of the inner layer to bond them thereto. The pressure is less than the extruding pressure of the thermoplastic material. Thereafter, the thermosetting outer layers are cured, and the inward pressure on the outer layers is maintained until the temperature is at least 50.degree. F. below the fusion temperature of the thermoplastic material. In this manner, a prestressed flat laminated panel is formed. If it is desired to form a curved panel, the flat panel is heated to the forming temperature of the thermoplastic material and i…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.