Curable composition
US5122436A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1990 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Apr 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable composition which comprises a homogeneous blend of (a) a solvent soluble polyimidesiloxane containing about 0.2-30 weight percent silicon and (b) an ethylenically unsaturated multifunctional monomer. The siloxane units in the polyimide-siloxane have from 10 to about 200 ##STR1## linkages per unit, more preferably from about 15 to about 100 linkages, and most preferably from about 40 to about 60 ##STR2## linkages per siloxane unit. Another embodiment provides the composition produced by curing the above-described composition. The curable compositions of this invention can be cured by either actinic radiation, e.g., uv light, or thermal radiation. In the cured composition, the polymer produced upon polymerization of the monomer, and the polyimide portion of the polyimide-siloxane form a homogeneous blend, in which the siloxane portion of the polyimide-siloxane is phase separated. The cured composition is a polymer network, and is particularly useful as a negative-working resist in the fabrication of electronic devices such as integrated circuit (IC) chips. The cured composition reduced stress at the polymer/metal interface of coated objects, thereby reducing curl in thin, c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.