Process and apparatus for forming bumps on film carrier
US5123163A · kind A · utility
6Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1990 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Apr 17, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53078
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A film carrier is used for fabricating a semiconductor device, and comprises an insulating film and a plurality of conductive leads each extending on the insulating film and having a front side surface and a reverse side surface, and a bump is formed in each of the conductive leads and has a projecting surface projecting from the reverse side surface and a depressed surface defining a recess open to the front side surface, so that the bump has a dome-shaped configuration and is much liable to deform in a thermocompression bonding stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.