Molding device for sealing semiconductor element with resin
US5123823A · kind A · utility
24Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1991 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Jan 15, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.