Non-destructive burn-in test socket for integrated circuit die
US5123850A · kind A · utility
248Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1991 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Jun 7, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0483
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.