Resin-bonding method
US5123989A · kind A · utility
61Cited by
8References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 11, 1990 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Jun 11, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/721
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.