Photoresist compositions
US5124233A · kind A · utility
8Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1988 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Jun 3, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Positive-working photoresist compositions containing PA0 (a) an epoxide resin which can be hardened by heat, PA0 (b) a latent urea or imidazole hardener for the component (a) and PA0 (c) an iron-arene complex of the formula (I) EQU [R.sup.1 (Fe.sup.II R.sup.2).sub.n ].sub.m.sup.+n [X].sub.n.sup.-m(I) PA0 in which n is 1 or 2, m is 1, 2, 3, 4 or 5, X is a non-nucleophilic anion, R.sup.1 is a .pi.-arene and R.sup.2 is an anion of a .pi.-arene, are described. These compositions are distinguished by good properties towards heat and chemicals and require short exposure times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.