Liquid light-sensitive resin composition
US5124234A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1991 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Jun 17, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F8/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A liquid light-sensitive resin composition comprising: PA1 (A) a modified polystyrene resin which has at least one styrene unit having at least one ethylenic unsaturated double bond and at least one carboxyl group; PA1 (B) a polymerizable compound having at least one ethylenic unsaturated double bond; PA1 (C) a compound having at least one epoxy group; PA1 (D) a photopolymerization initiator or a photopolymerization initiating system; PA1 (E) a thermohardening catalyst capable of inducing a thermal reaction of the at least one epoxy group; and PA1 (F) an organic solvent; is disclosed. This liquid light-sensitive resin composition can form a bubble-free light-sensitive resin layer of a uniform thickness on a printed circuit board; allows both of photohardening and thermohardening by heating the printed circuit board, on which the light-sensitive resin composition has been applied, prior to the exposure so as to lower the tackiness of the surface coated with the light-sensitive resin composition and adhering the film and a pattern mask followed by exposure; is highly sensitive; gives a film excellent in electrical properties, mechanical properties and chemical resistance after harden…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.