Composite foams of low thermal conductivity

US5124364A · kind A · utility

Assignee

• BASF SE

Inventors

• Bernardo Wolff · Mannheim, DE
• Frieder Hohwiller · Bad Dürkheim, DE
• Guenther Seybold · Schifferstadt, DE

Key dates

• Filing date: Dec 2, 1991
• Grant date: Jun 23, 1992
• Expiry date: Dec 2, 2011

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S521/919
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A composite foam of low thermal conductivity comprises PA0 a) 20-80% by volume of silica aerogel particles having a mean diameter of from 0.1 to 20 mm and a density of from 0.08 to 0.40 g/cm.sup.3, PA0 b) 20-80% by volume of styrene polymer foam which surrounds the particles of component a) and binds them to one another and has a density of from 0.01 to 0.15 g/cm.sup.3, and, if desired, PA0 c) conventional additives in effective amounts.