Filler-containing thermoplastic molding materials

US5124391A · kind A · utility

Assignee

• BASF SE

Inventors

• Klaus Muehlbach · Havelsee, DE
• Walter Goetz · Ludwigshafen, DE
• Bertram Ostermayer · Bad Dürkheim, DE

Key dates

• Filing date: Sep 7, 1990
• Grant date: Jun 23, 1992
• Expiry date: Sep 7, 2010

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L67/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Filler-containing thermoplastic molding materials containing, as essential components, PA1 A) from 10 to 84% by weight of a thermoplastic polyamide, PA1 B) from 10 to 84% by weight of a modified polyphenylene ether, PA1 C) from 5 to 40% by weight of a fibrous or particulate filler or a mixture thereof, and PA1 D) from 1 to 20% by weight of a zinc sulfide pigment, and, in addition, PA1 E) from 0 to 30% by weight of an impact-modifying rubber and PA1 F) from 0 to 25% by weight of a flameproofing agent, are described.