Waffleline-configured surface-mount package for high frequency signal coupling applications
US5124677A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1990 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Aug 22, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A waffeline-configured, surface-mount transmission line module contains a two-dimensional arrangement of periodically distributed conductive surface mesas and channels. Within the channels are segments of dielectrically surrounded conductor. The geometry of the arrangement of segments among the waffleline channels is defined in accordance with the intended signal coupling functionality of the interconnect structure. For example, in the case of a signal splitting application, the conductor segments may be arranged in a tree-like configuration between an input port and multiple output ports. Isolation resistors may be disposed within the channels of the waffleline between adjacent locations of diverging conductor runs among the mesas of the waffleline. The resulting transmission line module is then surface-mounted on the same printed wiring board as the signal processing components it is to interconnect, and respective portions of the segments of dielectrically surrounded conductor within the channels of the waffleline module are connected to signal ports of adjacent signal processing components. Because each waffleline interconnect module is relatively thin, multiple modules may be …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.