Pressure sensor package
US5125275A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1991 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Jun 19, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0084
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor package, having a dual-in-line package (DIP) structure as commonly used in the semiconductor industry, comprises a first layer of predetermined material, having at least one internal passage for transmitting a fluid under pressure from a first surface of the first layer to a second surface of the first layer. A pressure sensitive element is bonded to the first surface of the first layer, and covers an exit from the first surface of the internal passage. A lead package, has a plurality of pins, each pin being perpendicular to the first surface of the first layer and placed along a first and second length of the first layer exterior to the pressure sensor package, and having a spacing conforming to the DIP configuration. Predetermined points of the pressure sensitive element are electrically connected to predetermined pins. A second layer of predetermined material is bonded to the first surface of the first layer providing an enclosed spaced for the pressure sensitive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.