Resin flow and curing measuring device
US5125821A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1989 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0092
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measuring device for enabling an evaluation of a moldability of a thermosetting resin by determination of parameters suitable for high accuracy forecasting of flow and curing behaviors of the thermosetting resin within a metal mold, as well as a metal mold for molding a thermosetting resin and method for constructing runners of the metal mold which is effective to minimize if not prevent the occurrence of false in moldings. By utilizing unique or peculiar parameters of the thermosetting resin which are not influenced by a molding condition and by conducting a flow simulation with a metal mold having a flow passage of arbitrary dimensions using the determined values for the parameters, a forecasting of a flow in an actual metal mold is enabled so as to preselect optimum molding conditions and flow passage dimensions for a metal mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.