Thin film bonding method employing a structure for removing wetting agents
US5125999A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1990 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Apr 24, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1928
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.