Polycarbonate molding compositions
US5126404A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 1990 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | May 1, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L69/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding composition comprising PA0 A. 5 to 99% by weight (based on A+B) of a polycarbonate based on substituted dihydroxydiphenyl cycloalkanes PA0 B. 1 to 95% by weight (based on A+B) of a graft polymer prepared by a special process of PA1 5 to 90 parts by weight of a mixture of PA2 B.1.1. 50 to 95 parts by weight styrene, .alpha.-methyl styrene, C.sub.1-4 alkyl- or halogen-nucleus-substituted styrenes, C.sub.1-8 alkyl methacrylates, C.sub.1-8 alkyl acrylates or mixtures thereof and PA2 B.1.2. 5 to 50 parts by weight acrylonitrile, methacrylonitrile, C.sub.1-8 alkyl methacrylates, C.sub.1-8 alkyl acrylates, maleic anhydride, C.sub.1-4 alkyl-N-maleic imides, phenyl-N-maleic imides or mixtures thereof on PA1 B.2. 10 to 95 parts by weight of a diene rubber having an average particle diameter d50 of from 0.09 to 1 .mu.m and a gel content of more than 50% by weight and optionally at least one other thermoplastic resin which replaces up to 75% by weight of the polycarbonate A.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.