Low-hygroscopic sulfur-containing urethane resin, coating material and adhesive
US5126425A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1990 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Feb 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2280/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There are here provided a low-hygroscopic sulfur-containing and crosslinked structure-having urethane resin, urethane resin plate and shape-recoverable molding article which is prepared by first selecting a polyisocyanate compound having m (which is an integer of 2 or more) isocyanate groups in one molecule and a polythiol compound having n (which is an integer of 2 or more) thiol groups in one molecule so that the total number of m+n may be 5 or more, and then polymerizing the composition of the polyisocyanate compound and the polythiol compound; a low-hygroscopic sulfur-containing urethane coating material which comprises the above composition; and a low-hygroscopic sulfur-containing urethane adhesive which comprises the composition. In the resin of the present invention, its water absorption is as low as a level of 0.02 to 0.20% by weight, and its adhesion to a hard coating film is also good. The coating material and the adhesive of the present invention have a long pot life, a low water absorption and a high adhesive force even after dipping in warm water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.