Copper cored enclosures for hybrid circuits
US5126511A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1991 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Jan 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an enclosure for an electric circuit and the enclosure wherein there is provided a boat of material having a bottom and side wall, placing a material having a substantially higher thermal conductivity and a lower melting point than that of the boat in the boat bottom, heating the material to a temperature above the melting point thereof and below the melting point of the boat to cause the material to flow along the bottom to form a layer of the material thereon and join the layer to the bottom and side wall and removing a sufficient amount of the bottom of said boat to expose the layer. In accordance with a second embodiment, a depression is formed in the bottom, and when the material flows along the bottom, it fills the depression and becomes joined to the bottom. Plural such depressions can be provided. The exterior portion of the bottom is removed to expose the material if the depressions do not extend completely through the bottom. In accordance with a third embodiment, a block of metal with a hole therethrough is provided, and filled with a material having a higher thermal conductivity than the block of metal and a melting point below that of the block of m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.