Lead frame having at least two islands and resin molded semiconductor device using it
US5126823A · kind A · utility
17Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1991 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Mar 1, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.