Cooling system for an electronic circuit device
US5126919A · kind A · utility
47Cited by
1References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1988 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Oct 25, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.