Additive for fluxes and soldering pastes
US5127968A · kind A · utility
17Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1990 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Jul 31, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3612
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An additive contains a deactivation agent functioning at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the deactivation agent in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is prevented even though the activator remains on the base. The additive enables one to omit an unnecessary washing step from a preparation of electric circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.