High power, high density interconnect method and apparatus for integrated circuits
US5127986A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1989 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Dec 1, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive technique. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.