Area-selective metallization process
US5127998A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1990 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Jan 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.