Ring-alkylated m-phenylene diamine blends for use in curing epoxy resins
US5128059A · kind A · utility
2Cited by
7References
3Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 13, 1991 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Sep 13, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/5033
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Blends of diaminoisopropylbenzene (DAIBP) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transition temperatures as compared with resins cured with either diamine alone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.