Patent · US Expired

Polyamide molding compounds containing bisphenols of high glass temperature

US5128400A · kind A · utility

0Cited by

0References

13Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Hans-Detlef Heinz · Krefeld, DE
Aziz E. Sayed · Leverkusen, DE
Ralf Dujardin · Willich, DE
Rolf Dhein · Krefeld, DE

Key dates

Filing date	Oct 9, 1990
Grant date	Jul 7, 1992
Priority date	—
Expiry date	Oct 9, 2010

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K5/13
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to thermoplastic molding compounds based on polyamides and bisphenols having glass temperatures equal to or above those of the polyamides used, the bisphenols corresponding to the following formula ##STR1## The invention also relates to a process for their production and to their use for the production of moldings, films, fibers and other articles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.