Polyamide molding compounds

US5128401A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Hans-Detlef Heinz · Krefeld, DE
• Aziz El-Sayed · Leverkusen, DE
• Werner Kloker · Krefeld, DE
• Ralf Dujardin · Willich, DE

Key dates

• Filing date: Jan 18, 1991
• Grant date: Jul 7, 1992
• Expiry date: Jan 18, 2011

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A polymeric molding compositon based on aliphatic polyamides contains as additives polyarylene sulfides and polyphenolic compounds free from tertiary alkyl group ortho to the phenolic-OH groups is useful in producing molded articles such as films, fibers and shaped objects.