High-temperature adhesive compositions
US5128403A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1991 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Apr 10, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A one-coat adhesive composition which utilizes environmentally acceptable ingredients and which can withstand high temperature conditions such as those experienced during injection molding processes. The adhesive contains a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent, a phenolic resin, an aromatic hydroxy compound, a formaldehyde donor, a heat-activated unsaturated elastomer crosslinker, a vulcanizing agent, and a metal oxide. An adhesive bond prepared with the adhesive is resistant to high temperature fluids and corrosive agents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.