EHF array antenna backplate including radiating modules, cavities, and distributor supported thereon
US5128689A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1990 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Sep 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/005
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An EHF array antenna backplate that integrates thermal cooling structure and signal processing structure together into one unified structure. In one embodiment, forced air is employed to conduct heat from active modules; while in another embodiment, embedded heat pipes are employed. The array backplate is made by using four layers. The layers are: a high density multichip interconnect board, a metal matrix composite motherboard, an integrated waveguide/cavity/cooling structure, and a metal matrix composite baseplate. Each module uses solder bumps to connect to the high density multichip interconnect board where DC power and control logic signal distribution takes place. The modules are soldered in four locations to the metal matrix composite motherboard through openings in the high density multichip interconnect board. EHF signals are coupled to the modules from a resonant cavity via probes that protrude through the high density multichip interconnect board. Probes are strategically located in the resonant cavity to pick up an EHF standing wave generated by slots that are part of a slotted planar waveguide EHF 16-way power divider network. The waveguide/cavity/cooling structure is …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.