Electronic devices, method for forming end terminations thereof and paste material for forming same
US5128827A · kind A · utility
15Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1991 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Mar 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved electronic device having metal-glazing type end terminations comprising a surface metal phase of Sn or Zn, is produced by sintering a paste material containing a matrix metal powder (Cu and/or Ni), a fluxing metal powder and an organic binding material, so that the surface portion serves to improve wettability and solderability of the end termination owing to its composition being similar to solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.