Encapsulated circuitized power core alignment and lamination
US5129142A · kind A · utility
90Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1990 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Oct 30, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.