Actively cooled effusion cell for chemical vapor deposition
US5129360A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1990 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Jan 24, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An actively cooled effuser for a vapor deposition reactor is placed in very close proximity to a substrate. The actively cooled effuser has combinations of gas directing plates, cooling plates and isolation plates attached together. Reactants and coolant are input into the stack of plates so formed. Selective heating of the substrate surface may occur through the use of heating lamps. Multiple units of the actively cooled effuser and heating lamps may be used in the reactor to form multiple layers on the substrate. The cooling plate has a cooling channel within a few thousandths of an inch of the output side of the stack. The presence of the cooling plates allows the effuser to be placed in very close proximity to the selectively heated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.