Low-force, high-density gel connector
US5129833A · kind A · utility
20Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 26, 1991 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Jun 26, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1061
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector assembly (10) for electrically interconnecting a component (20) to a circuit (12) includes a housing (50) containing the component with conductive pads (22) of the component and conductive pads (14) of the circuit aligned with a connector (30) including a flexible film (34) carrying contact pads (38, 40) interconnected by a conductive material (42) in a hole (36) and carrying conductive gel contacts (44, 46) which project above and below the film surface to be compressed upon housing closure to drive the said component against the said film and circuit to thus minimize contact forces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.