Diamond composite heat sink for use with semiconductor devices
US5130771A · kind A · utility
36Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1990 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Nov 5, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A heat sink for a semiconductor component of a heat-dissipating and light-radiating semiconductor electronic device. Diamond particles are embedded in a metal matrix to form a composite having a coefficient of thermal expansion which is substantially that of the semiconductor component of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.