Three-dimensional circuit modules
US5130894A · kind A · utility
87Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 26, 1990 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Nov 26, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a three-dimensional circuit structure particularly useful in semiconductor memories. The circuit structure consists of a stack of modules mounted on a mother board with connectors between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.