Gas-liquid forced turbulence cooling
US5131233A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1991 |
| Grant date | Jul 21, 1992 |
| Priority date | — |
| Expiry date | Mar 8, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/911
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.