Method of hot forming beryllium-copper alloy and hot formed product thereof
US5131958A · kind A · utility
3Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1990 |
| Grant date | Jul 21, 1992 |
| Priority date | — |
| Expiry date | Mar 15, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of hot forming beryllium-copper alloy including from 1.60 to 2.00% by weight of Be, from 0.2 to 0.35% by weight of Co and the balance being essentially Cu, under specified conditions of a working temperature, a working rate, and an amount of work strain to produce a hot formed product of an equiaxed grain structure having a uniform stable grain size. 2
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.