Patent · US Expired

Method of fabricating imaging apparatus

US5132195A · kind A · utility

12Cited by
7References
41Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 30, 1991
Grant dateJul 21, 1992
Priority date
Expiry dateAug 30, 2011

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/12
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a method for fabricating imaging apparatus, adjoining regions, each forming only part of the active area of the complete device, are laid down separately, enabling larger active areas to be produced than would otherwise be possible using conventional wafer stepper equipment. In the complete device, imaging may be arranged over the boundary between the regions and/or charge may be transferred across the boundary.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.