Direct write with microelectronic circuit fabrication
US5132248A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 1988 |
| Grant date | Jul 21, 1992 |
| Priority date | — |
| Expiry date | May 31, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.