Carrier ring having first and second ring means with bonded surfaces
US5132773A · kind A · utility
13Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1991 |
| Grant date | Jul 21, 1992 |
| Priority date | — |
| Expiry date | Feb 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A two-piece carrier ring is provided. First and second rings are affixed to opposing sides of the exterior portion of a leadframe and protect the leads from distortion. The rings are molded prior to bonding to the leadframe so that the rings may be formed from a wide variety of plastics. The premolded rings are polymerized prior to bonding preventing distortion of the leads by shrinking of the rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.