Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5133495A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1991 |
| Grant date | Jul 28, 1992 |
| Priority date | — |
| Expiry date | Aug 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, forms a substantially spherical ball and connects to the flexible circuit's conductor, connecting the two. In an alternative embodiment, the solder ball is formed to its desired shape and cooled (to solidification), separate from the flexible circuitized substrate. The flexible substrate is then lowered until the conductor engages the solder ball's upper surface. Heat is then applied to bond solder and conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.