Process for producing metal-polyimide composite article
US5133989A · kind A · utility
8Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Jul 28, 1992 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.