High T.sub.C microbridge superconductor device utilizing stepped edge-to-edge SNS junction
US5134117A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1991 |
| Grant date | Jul 28, 1992 |
| Priority date | — |
| Expiry date | Jan 22, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/742
Abstract
A microbridge superconductor device includes a substrate, made of a material such as LaAlO.sub.3, having a lower planar substrate surface, an inclined surface having an overall upward inclination of from about 20 to about 80 degrees from the plane of the lower planar substrate surface, and an upper planar substrate surface parallel to the lower planar substrate surface and separated from the lower planar substrate surface by the inclined surface. A layer of a c-axis oriented superconductor material, made of a material such as YBa.sub.2 Cu.sub.3 O.sub.7-x, is epitaxially deposited on the lower planar substrate surface, and has an exposed a-axis edge adjacent the intersection of the lower planar substrate surface with the inclined surface. The a-axis exposed edge is beveled away from the intersection. A layer of a c-axis oriented superconductor material is epitaxially deposited on the upper planar substrate surface, and has an exposed a-axis edge adjacent the inclined surface. A gap lies between the two a-axis exposed edges. A layer of a non-superconductor material, such as silver, lies in the gap between the two exposed a-axis edges, thereby defining a SNS superconductor microbridge…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.