Adhesive compositions
US5134221A · kind A · utility
2Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1991 |
| Grant date | Jul 28, 1992 |
| Priority date | — |
| Expiry date | Oct 22, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G63/181
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Linear saturated copolyesters of terephthalic acid, isophthalic acid, butanediol, and one or more aliphatic diols having at least 13 carbon atoms used as adhesives for the formation of wash-resistant bonds especially for temperature-sensitive materials. Preferably, the melting points of these adhesive compositions are from 50.degree. to 170.degree. C. and their relative viscosities, measured as 1% solutions in meta-cresol at 20.degree. C., are 1.40 to 1.80.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.