Method for making a credit card containing a microprocessor chip
US5134773A · kind A · utility
Inventors
Key dates
| Filing date | May 22, 1990 |
| Grant date | Aug 4, 1992 |
| Priority date | — |
| Expiry date | May 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
According to the invention, the electronic module (1) which is to be contained in the card is formed by producing the electronic circuit out of a metal strip (19) which is pre-cut and pre-formed in order to present contact members (10), the electronic chip being then soldered and wired to said strip; the said electronic module (1) is then coated with resin forming a resin block (14), and during the moulding of the card, a pressure P is applied to the mould (103) for firmly clamping the electronic module (1) between the mold shells and for securing it within positioning and blocking means as well as for pressing its contact members (10) against the inner wall of the mould.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.