High modulus silicones as toughening agents for epoxy resins
US5135993A · kind A · utility
12Cited by
1References
1Claims
0Family size
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Key dates
| Filing date | Sep 11, 1990 |
| Grant date | Aug 4, 1992 |
| Priority date | — |
| Expiry date | Sep 11, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones, and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.