Method of forming sliding surfaces
US5137619A · kind A · utility
3Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1991 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | May 31, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming sliding surfaces, wherein a first plating layer with a relatively high level of hardness is formed by using a first plating liquid which is at a relatively low temperature; and a second plating layer with a hardness lower than that of the first plating layer is formed on the surface of the first plating layer by using a second plating liquid which is at a temperature higher than that of the first plating liquid; the second plating layer being honed to a predetermined thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.