Process for making thick multilayers of polyimide
US5137751A · kind A · utility
33Cited by
22References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1990 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | Nov 13, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.