Hybrid/microwave enclosures and method of making same
US5138114A · kind A · utility
7Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1990 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | Sep 27, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.